Packaging and testing production line
Breaking through the bottleneck of high-end storage packaging and testing
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We can provide one-stop services for wafer packaging, testing, R&D design, and production, and master advanced packaging technologies such as SIP, BGA, LGA, QFN, etc. Capable of mass production of 16 Die stacked chips and reserves 32 Die stacked technology, with a single flash memory chip capacity exceeding 2TB, achieving industry-leading performance and reliability.